Topics

ICEAF VII will be the seventh event of a biennial conference series which commenced in Patras on May 2008 and gathers high-level scientists from all over the world. The aim of the Conference is to provide a forum to present interdisciplinary work dedicated to design against engineering failure, concepts and technologies to prevent of failure as well as approaches, technologies and tools for failure analysis.  Works are expected to cover a number of different technological and engineering areas including aeronautics and space, automotive, marine, wind-energy, oil refineries and chemical industry, civil engineering applications, etc. Amongst others, the conference topics include:

  • Engineering alloys and metals
  • Novel engineering composites
  • Bio-based engineering composites
  • Recycling of structural composites
  • Nanomaterials: technology, properties and modeling fracture behavior
  • Smart materials and structures
  • Multiscale (nano, meso, micro and macroscopic) approaches to understand mechanical behaviour and fracture of engineering materials and structures
  • Hybrid materials (metal-metal, metal-composites, hybrid composites)
  • Damage tolerant microstructures
  • Damage tolerance of stiffened structures
  • Structural integrity and structural health monitoring
  • Fracture and fatigue of materials and structures
  • Surface engineering and coatings
  • Corrosion, wear and surface degradation of materials and structures
  • Experimental studies on the relation between microstructure and mechanical fracture processes
  • Testing and control systems
  • Computational mechanics and analytical methods
  • Modeling and simulated assessment of biomedical systems and materials
  • Multi-scale and multi-physics computational simulation of structural response / model validation
  • Model validation by full-field experimental methods
  • Characterization of fractures
  • Environmentally assisted fracture
  • Integrated approaches for design, manufacturing and reliability of engineering structures
  • Joining technologies
  • Non-destructive testing